ReCET - Real-Time Micro Focus X-ray Equipment
The x-ray system is a non-intrusion system ideally suited for:
- Inspection
- Fault Analysis
- Quality Control
- Research and Development
The system can be used on a wide range of applications
including electronic assemblies and components and mechanical
assemblies and components.
Ceramics, plastics and composites can be analysed to
determine fibre structures and alignment in carbon fibre devices,
castings and welds can be inspected for porosity, cracks,
inclusions and non-uniformity
Real-Time Micro Focus X-ray Equipment
It can be used on populated and unpopulated PCB's as well as individual components
by inspection of the following:
- Broken wedge bonds
- Lifted ball bonds
- Surface mount defects
- Vias
- Multi-layer alignment
The system features a high magnification of up to 1800x. The focal spot size can be as
small as 2 microns, which means the smallest detail can be identified. E.g. the image
opposite shows the bond wires on an IC, this can be used to check for breaks in the
wires.
The system includes an auto BGA inspection process that consists of:
- Short circuit analysis
- Void calculations
- Ball count
- Ball alignment
- Ball size
The image to the left shows shrinkage cracks on a welded joint after cooling.
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